Solar cell Module : 太陽能模組 
Non contact Sheet Resistance, film/wafer Thickness, metrology tool for in-line (CMP), on-line (300mm) and off-line usage : 非接觸式新型電磁共振分析儀,可最精準量測片電阻,晶片厚度,薄膜厚度,
Intelligent Wafer Gripping System (300 and 200mm),智慧型晶片固定運送手臂.
Plasma Cleaning system – Automatic continuous & Bath type,大型電漿清洗設施.
Curing Oven – Automatic PC control,全自動大型固化爐
Backend tool- Tape& Reel, Press, Solder tap insert, Handler…半導體後段封裝,測試設備.
IC substrate, tray, socket, Silver & Non conductive paste. 半導體後段封裝,測試耗材.
Ion Miller for SEM/TEM sample preparation. 超快速全自動試片離子薄化裝置及附屬設備.
IC auto decap system for EFA and PFA. 新型快速全自動IC開蓋裝置
Scanning Acoustic Microscope. 超音波顯微鏡.
3D X-ray inspection tool, X光顯微鏡.
3D SEM/TEM lab service. 立體SEM/TEM定量分析服務.
Nano particle measurement – DLS techniques and fast analysis. 超快速動態雷射奈米顆粒分析儀.
Nanotechnology, Surface Science and FA tool. 奈米科技,表面分析,破壞分析等各式設備,儀器,耗材.